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IRT Nanoelec News

Large multi-core 3D systems with multiple chiplets integrated on an active silicon interposer to support High Performance Computing (HPC) applications

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  Perceval Coudrain (CEA-Leti) who works on 3D integration and advanced encapsulation, in the frame of IRT Nanoelec, received the “Best Paper Award” at the ECTC conference (May 2019, Las Vegas, USA) for his article entitled “Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures”. The paper reports the first successful technological integration of chiplets… Lire la suite » ... Read more »

Photonics | Discovering the CEA silicon photonics platform developed in the framework of the institute

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At Photonic West (4-6 Feb, 2020, San Francisco, USA) ) and at Optical Fiber Communication Conference and Exhibition (10-12 March, 2020 San Francisco, USA ), CEA-Leti presented the evolution of the silicon photonics platform developed in the framework of the institute. Particularly, this platform enables the integration of two optical waveguide layers – in silicon… Lire la suite » ... Read more »

Educ & train | 25 PhD students discovered characterization technics based on neutronic and X-ray synchrotron radiations

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In March 2020, a brand new training module took place on the EPN campus (ILL–ESRF, Grenoble, France) for 25 students from the Postgraduate School of the Grenoble Alpes University. Designed by the “large-scale instrument characterization program “and the “training program” of the Institute, the module provided PhD students with an overview of different synchrotron and… Lire la suite » ... Read more »

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