Perceval Coudrain (CEA-Leti) who works on 3D integration and advanced encapsulation, in the frame of IRT Nanoelec, received the “Best Paper Award” at the ECTC conference (May 2019, Las Vegas, USA) for his article entitled “Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures”. The paper reports the first successful technological integration of chiplets… Lire la suite » ... Read more »
IRT Nanoelec News
At Photonic West (4-6 Feb, 2020, San Francisco, USA) ) and at Optical Fiber Communication Conference and Exhibition (10-12 March, 2020 San Francisco, USA ), CEA-Leti presented the evolution of the silicon photonics platform developed in the framework of the institute. Particularly, this platform enables the integration of two optical waveguide layers – in silicon… Lire la suite » ... Read more »
In March 2020, a brand new training module took place on the EPN campus (ILL–ESRF, Grenoble, France) for 25 students from the Postgraduate School of the Grenoble Alpes University. Designed by the “large-scale instrument characterization program “and the “training program” of the Institute, the module provided PhD students with an overview of different synchrotron and… Lire la suite » ... Read more »
On March 13, 2020, IRT Nanoelec hold a webinar workshop “Bridging the gap between semiconductor technologies and architecture” design focussed on 3D integration, Photonics & Cybersecurity. Additional contents to the workshop 13/3/2020 Video here. Introduction IRT Nanoelec at a glance Hugues Metras, IRT Nanoelec, France See Hughes slides About the talk : The presentation will… Lire la suite » ... Read more »
250 participants from 200 companies met in Lyon, on Dec. 12th 2019 for the Annual Meeting of Minalogic, global innovation cluster for digital technologies based Auvergne-Rhône-Alpes region in France and founding member of the IRT Nanoelec. This event aimed at illustrating how the network opens up opportunities for cooperation across traditional boarders of company sizes,… Lire la suite » ... Read more »