Intel Corporation announced (PRESS RELEASE | 2020.10.27) a new collaboration with CEA-Leti on advanced #3D and packaging technologies for processors to advance chip design. The research will focus on further reducing the size of computer chips, optimizing interconnection technologies between the different elements of #microprocessors, and on new bonding and stacking technologies for silicon #wafers,… Lire la suite » ... Read more »
IRT Nanoelec News
Radiation effects in semiconductor devices is one of the major reliability concerns in today’s electronics. Continuous scaling and the ubiquitous presence of sensors and components in our day-to-day life have brought these effects to play a main role in the performance of electronic systems. Moreover, several reliability questions arise from new applications (such as self-driving… Lire la suite » ... Read more »
The French reference magazine for industry and innovation l’Usine nouvelle selected Soitec as “Factory fo the year”. Within its site of Bernin (France), Soitec produces “silicon on insulator, an innovative sandwich of materials which is the pride of electronics in France and in Europe and of which French is the world king”. Soitec is member… Lire la suite » ... Read more »
Scintil Photonics is listed in the top 5 of the emerging integrated photnics solutions by Startus Insigths professional blog. 94 integrated photonics solutions has been analized. The Scintil’s solution “enables high-coupling efficiency, on-chip optical amplification, as well as intrinsic hermetic design, and a compact form-factor”, underlines the paper. ... Read more »
In lateral power diodes, the conductivity modulation mechanism can pave the way to the demonstration of surge current capability. In a Hybrid Anode Diode concept with a p-GaN layer, an anode contact on p-GaN layer can be a source of hole injection that increases the electron density at AlGaN/GaN interface. In a paper presented at… Lire la suite » ... Read more »