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IRT Nanoelec News

Advance Chip Design Through Cutting-Edge 3D Packaging Technologies

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Intel Corporation announced (PRESS RELEASE | 2020.10.27) a new collaboration with CEA-Leti on advanced #3D and packaging technologies for processors to advance chip design. The research will focus on further reducing the size of computer chips, optimizing interconnection technologies between the different elements of #microprocessors, and on new bonding and stacking technologies for silicon #wafers,… Lire la suite » ... Read more »

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