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IRT Nanoelec News

To Reduce the Cost and Size, and Improve Performance of Lidar Systems

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#Press Release @Photonics West’21 Taking a critical step toward developing LiDAR systems for widespread commercial applications, CEA-Leti, in the frame of Nanoelec/Photonics Sensors program, has developed genetic algorithms to calibrate high-channel-count optical phased arrays (OPAs), as well as an advanced measurement setup enabling wafer-scale OPA characterization. OPAs are an emerging technology made of arrays of… Lire la suite » ... Read more »

Heterogeneous Integration with Collective Die-to-wafer Hybrid and Fusion Bonding Demonstration

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EV Group, a core partner of Nanoelec consortium, successfully demonstrates end-to-end process flow for collective die-to-wafer bonding with sub-two-micron placement accuracy, (see PR in last october). This breakthrough represents an important milestone in accelerating the deployment of heterogeneous integration in next-generation 2.5D and 3D semiconductor packaging. Such technologies are required for leading-edge applications such as artificial… Lire la suite » ... Read more »

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