The purpose of the International Cybersecurity Forum (Forum International de la Cybersécurité) is to generate new insights and provide a forum for discussion with the overriding goal of promoting a European vision of cybersecurity. Amid the Single Digital Market and upcoming regulations targeting the protection of personal data, the Forum has emerged as Europe’s leading… Lire la suite »
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The objective of the training was to equip first-year students at Esisar with the cybersecurity knowledge that all experienced users should have. Grenoble Institute of Technology’s Esisar school of engineering has implemented a strategy to boost its students’ knowledge of cybersecurity and obtain ANSSI (France’s national agency for information systems security) certification for the training… Lire la suite »
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IRT Nanoelec’s characterization on large instruments program organized the fourth Carac’ conference at the EPN Platform for Advanced Characterization Grenoble (PAC-G) on November 23, 2017. The event showcases the Grenoble ecosystem’s unrivalled characterization resources and gives businesses a chance to meet researchers specializing in materials in virtually every field of engineering, with applications in a… Lire la suite »
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Research on copper pillars for 3D integration conducted with the support of Leti and the European Synchrotron Radiation Facility earned Alexandra Fraczkiewicz the Best Student Paper Award at the International Symposium for Testing and Failure Analysis (ISTFA) in California in December 2017. The research demonstrated how tomography using X-rays emitted by a synchrotron source can… Lire la suite »
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The research presented at IEDM was conducted under the IRT Nanoelec silicon photonics program. The objective of the research is to integrate hybrid III-V silicon laser sources into 200 mm photonics using CMOS-compatible processes. The longer-term objective of the research is to achieve large-scale integration of these types of components by locally die-attaching III-V chips… Lire la suite »
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In research conducted under the IRT Nanoelec 3D integration program, a 300 mm hybrid wafer-to-wafer bonding process including ultra-thin (500 nm diameter) copper connections with an optimized pitch of 1μm was successfully demonstrated for the first time worldwide. The IRT Nanoelec 3D integration program achieved this major technological advance in Leti’s clean rooms using EVG’s… Lire la suite »
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Grenoble Institute of Technology has been a long-standing partner of IRT Nanoelec’s training and education programs. What is your perspective on the last five years as a partner? Grenoble Institute of Technology has three missions: to offer degree programs in engineering, to conduct research, and to build relationships with businesses to ensure that we… Lire la suite »
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The last IRT Nanoelec conference of 2017 brought in around 60 participants who came to learn about the findings of the IRT Nanoelec socioeconomic impact assessment. The event provided an opportunity to review the socioeconomic impact studies completed since IRT Nanoelec’s inception. IRT Nanoelec Associate Director Bruno Ragué gave a presentation on the assessment and… Lire la suite »
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A new partner joined the IRT Nanoelec consortium in December 2017. Almae Technologies specializes in the deposition of III-V materials used in silicon photonics component technology bricks. The company will bring know-how in custom epitaxy techniques and photonic components for telecommunications applications. Almae Technologies is involved in the IRT Nanoelec silicon photonics program.
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IRT Nanoelec held the first-ever national silicon photonics meeting on November 27, 2017 in Paris. The meeting on “Silicon photonics: a breakthrough just over the horizon” was attended by major silicon photonics stakeholders from across France. The meeting was attended by more than 50 people, including representatives of organizations like Nokia, II-V Lab, Orange Lab,… Lire la suite »
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