Stéphane Moreau joins ITRS 2.0 working group on electromigration in heterogeneous integrations

Stéphane Moreau, a researcher at IRT Nanoelec partner Leti, has joined the ITRS 2.0 committee.

Stéphane will contribute his in-depth knowledge of electromigration issues arising from heterogeneous 3D integrations (the three-dimensional packaging of single and multiple chips). His experience developing technology under the IRT Nanoelec 3D Integration program will be crucial to the International Technology Roadmap for Semiconductors, which must take into account challenges like power consumption, current density, and heat dissipation.

Learn more: