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IRT Nanoelec News

Three-Layer Integration Breakthrough for AI-Embedded CMOS Image Sensors

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At the IEEE 74th Electronic Components and Technology Conference (ECTC 2024, Denver, Colorado, May 28 – 31, 2024), CEA-Leti demonstrates feasibility of combining hybrid bonding and high-density through-silicon vias. These development are conducted to meet the needs of the Nanoelec/Smart Image program. CEA-Leti scientists reported a series of successes in three related projects at ECTC 2024 that are… Lire la suite » ... Read more »

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