3D Integration: Heterogeneous 3D Architectures and Sensors

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Pascal Vivet (CEA-List) Deputy-Director of the Nanoelec/Smart Imager program is coordinating the program of this workshop.

[WORKSHOP] The 3D Integration Workshop took place in Design, Automation and Test in Europe Conference (DATE) from 2009 to 2015 and took place again in 2022. With the continued evolution of 3D technologies in terms of interconnect density and its evolving manufacturing eco-system, there is a strong need to pursue the research efforts on key aspects of architecture and design, according to the potential capabilities offered by 3D integration.
#Nanoelec supports the DATE 3D Integration Workshop. The goal is to bring together experts from both academia and industry, interested in this exciting and rapidly evolving field, in order to update each other on the latest state-of-the-art, exchange ideas, and discuss future challenges.

At Nanoelec, 3D integration is giving way to two programs focusing on  image applications: one devoted to display technologies (Displed) and the other to sensing (Smart Imager).
>> Read more on our programs.