SET at Semicon Taiwan trade show

IRT Nanoelec partner SET was at Semicon Taiwan from September 18 to 20, 2019.

SET showcased its latest machine, the NEO HB automatic flip-chip hybrid/direct bonder, at Semicon Taiwan. The machine offers very high precision after assembly (± 1 µm @ 3 sigma), high throughput (hundreds of chips per hour), and very low particle contamination levels compatible with direct bonding. The machine’s performance is ideal for production markets with very low interconnect pitches (less than 10 µm), such as high-performance computing and memory stacks.