IRT Nanoelec at Semi 3D Summit 2019

The 7th Semi 3D Summit took place on January 28–30, 2019, bringing in nearly 200 attendees once again! The event is the perfect place to catch up on the latest advances in 3D integration and advanced packaging from research organizations and industrial R&D centers.

The IRT Nanoelec 3D integration program presented its latest advances and, most notably, the IntAct demonstrator (an active interposer for HPC applications by the CEA) and the Harmony demonstrator (a 3D-assembled low-power image sensor).

IRT Nanoelec partners STMicroelectronics, the CEA, SET, and EVG attended the Summit, which has become an event 3D integration stakeholders in Europe don’t like to miss!