
![]() | The unmatched performance of large-scale instruments must be identified by industrial users as a cutting-edge tool to perform advanced characterizations of electronic components and devices. Read more on issues and context of the carac program here |
![]() | Develop a competence center for testing radiation hardness of electronic components. |
![]() | Continue to make unique scientific instruments & methodologies available to meet the new challenges of the electronics industry for the serenity and sovereignty of the digital transition. |
![]() | CEA, CNRS/LPSC, ESRF, ILL, Schneider Electric, Soitec, STMicroelectronics, Iroc Technologies |

Direct link to PAC-G Plateform