International Conference Photonics West

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CEA provides a dedicated workshop as a side event at @Photonic West Conference. During his talk on Next Gen photonics platforms for rising applications, Bertrand Szelag, Integrated Photonics Program Manager @CEA-Leti, presents III-V material integration on Si photonics platform through direct bounding (wafer to wafer & die to wafer). Developed in the frame of Nanoelec, the process is available for 200 and 300 mm wafers. It is CMOS compatible ready for large scale integration.

Program of the workshop here