IRT Nanoelec institute runs multi-partner programs in R&D, technology dissemination and human capital to make the microelectronics sector more competitive.
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3D packaging: Achieving 3-layer stacking integration for future smart imagers
This article focuses on the silicon technology developments done by CEA-Leti regarding wafer-to-wafer hybrid bonding and HD TSVs and it presents the recent demonstrations of 2-layer and 3-layer stacking integrations. These demonstrations, together with the work done by other partners of the IRT Smart Imager Program (STMicroelectronics, Siemens EDA, Prophesee, Lynred, Grenoble INP-UGA) on applications… Lire la suite »
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[SYMPOSIUM] SUSTAINABLE ELECTRONICS AND DIGITAL TECHNOLOGIES
On December 12, 2024, Nanoelec, the PUI Grenoble Alpes, the PEPR Electronics, and the Labex UGA Electronics organize a symposium on sustainable electronics and digital technologies in Grenoble. Researchers from all fields across the Alpine arc are called upon to submit contributions for the symposium. Contributors will highlight their latest advancements in tools, methodologies,… Lire la suite »
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Navigating the Eco-Design Paradox: Criteria and Methods for Sustainable Eco-Innovation Assessment in Early Development Stages
This paper examines the growing importance of eco-innovation in aligning sustainability with technological development. It explores the ‘eco-design paradox’, which emphasizes the tension between the need for flexible design and the availability of data required for assessing environmental impacts during early innovation stages. This paradox presents a challenge: the lack of detailed data can have… Lire la suite »
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#INWED24: [PODCASTS] Discover the impact of women in the nanoelectronics industry
On the occasion of #INWD24 International Women In Engineering Day, Nanoelec’s Human Capital & Training Engineering program publishes podcats sound three produced by the Women and Economic Renewal chair at Grenoble-Ecole de management (GEM) with three experts from the Siemens group. The first episode features Flore Gouaux, who tells us about her job as an… Lire la suite »
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#INWED24: [PODCASTS] Discover the impact of women in the nanoelectronics industry
On the occasion of#INWD24 International Women In Engineering Day, Nanoelc progrma dedicated to Human Capitla & Trainign Design provides tree radio podcats produced by the chair Omen é Economic renewal at Grenoble-Ecole de management (GEM) with tree expert.es from Siemens. The first episode features Flore Gouaux, who tells us about her job as an “innovation… Lire la suite »
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[WEBINAR] Diversity networks in worldwide companies
Nanoelec and Femmes ingénieures webinar on the occasion of International Women In Engineering Day #INWED24 >> Friday June, 28 2024 For several years now, International Women Engineers Day #INWED has been celebrated in June, notably by the British Women’s Engineering Society. This year, Nanoelec and the Femmes ingénieures association are also celebrating this event in… Lire la suite »
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Three-Layer Integration Breakthrough for AI-Embedded CMOS Image Sensors
At the IEEE 74th Electronic Components and Technology Conference (ECTC 2024, Denver, Colorado, May 28 – 31, 2024), CEA-Leti demonstrates feasibility of combining hybrid bonding and high-density through-silicon vias. These development are conducted to meet the needs of the Nanoelec/Smart Image program. CEA-Leti scientists reported a series of successes in three related projects at ECTC 2024 that are… Lire la suite »
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Multiple-Stacked-Wafer (MSW) technology
“Multiple-Stacked-Wafer (MSW) technology : the appropriate technology for ultra-low power Smart Sensor” Deputy Director of the IRT Nanoelec/Smart Imager program, sébastien Thuries, will give a talk Design, Automation and Test in Europe Conference (DATE) on 26 march 2024, in the frame of a workshop dedicated to Heterogeneous 3D Architectures and Sensors
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[WEBINAR] A data driven approach for comprehensive Life Cycle Assessment and effective eco design of the IOT
Ernesto Quisbert-Trujillo, now researcher at the G-Scop laboratory (Grenoble INP-UGA), will be presenting his work on methodologies for assessing the frugality of IOT-type connected devices, through the specific case study of a sensor designed to control water consumption in a domestic environment. “All our findings are discussed with a view to contributing to the state… Lire la suite »
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[SYMPOSIUM] Addvisia @Mems & Imaging Sensors Summit
Addvisia, the platform for exploring new uses in multimodal imaging and associated fusion capabilities will be presented at the Mems & Memory Summit (September 19-21, 2023 in Grenoble, France) Applications of imaging technologies have been significantly developed and improved in recent years. However, for very specific applications, the selection and testing of imaging systems can… Lire la suite »
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