IRT Nanoelec attended the 13th IMAPS International Conference and Exhibition on Device Packaging from March 7 to 9 in Phoenix.
The IMAPS International Conference and Exhibition on Device Packaging is the world’s leading 3D packaging and integration event. This year’s conference was chaired by Leti’s Gilles Poupon, an internationally-renowned packaging expert, and attracted 526 participants representing 19 countries. The event provided an excellent opportunity to present our latest advances in hybrid-bonding-type 3D interconnect technology, the fruit of know-how from Leti, STMicroelectronics, EVG, and SET, all IRT Nanoelec founding partners.
