Advanced Smart Vision

Innovative solutions & technologies to enable new advanced smart vision systems based on innovative CMOS imagers, new RF imaging radars and Edge AI implementation

The purpose of the program ASV

As part of IRT Nanoelec’s “Advanced Smart Vision (ASV)” program, the goal is to develop innovative solutions and technologies to implement new advanced smart vision systems based on innovative CMOS sensors, new RF imaging radars, and the deployment of AI at the edge. This program will enable the development of both the key 3D silicon technologies essential for multilayer architectures, heterogeneous integration, and the implementation of edge AI, as well as the associated CAD tools and methodologies required to build these complex architectures. This represents a significant step forward and a shift in mindset, as the construction and combination of various advanced imaging solutions enhanced by edge AI through heterogeneous integration and advanced packaging pose a major challenge. All these developments will pave the way for new applications and market opportunities and help strengthen the competitiveness of the industrial partners involved in the project.

The SVA program incorporates the Addvisia multispectral platform (see below).

Addvisia : multipectral imaging

Led by a CEA team and stemming from an IRT Nanoelec initiative, the Addvisia technology dissemination hub fosters a community of interest focused on multimodal and multispectral imaging to explore the full potential of combined imagers and identify new applications.

At the heart of the hub is an easily accessible, continuously evolving multi-imager test platform. This modular platform brings together technology suppliers, integrators, and users around common goals: to better understand why and how imagers can be combined for new applications, within an agile experimental environment.

Program at a glance

Vision

The shift from imagers to vision sensors is creating new market opportunities.

Ambition

Provide key hardware and software building blocks, and validate them through demonstrations ranging from test vehicles and proof-of-concepts to the prototyping of a multi-layer smart imager

 

Mission

  • 3D stacking technologies, artificial intelligence, and embedded data management
  • New electronic architectures

Partners

CEA, Grenoble INP-UGA, Lynred, Prophesee, Siemens EDA, STMicroelectronics

Vision

The shift from imagers to vision sensors is creating new market opportunities.

Ambition

Provide key hardware and software building blocks, and validate them through demonstrations ranging from test vehicles and proof-of-concepts to the prototyping of a multi-layer smart imager

 

Mission

  • 3D stacking technologies, artificial intelligence, and embedded data management
  • New electronic architectures

Partners

CEA, Grenoble INP-UGA, Lynred, Prophesee, Siemens EDA, STMicroelectronics

Eric Ollier, Directeur du programme Nanoelec/Smart Imager (c) P. Jayet/CEA

Your contacts for ASV

The ASV program is managed by Eric Ollier (c) P.Jayet/CEA


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