SET, a new IRT Nanoelec partner
Tell us a little bit about your company.
SET, which stands for Smart Equipment Technology, designs, manufactures, and sells equipment for the microelectronics industry and, in particular, precision flip-chip bonders, which are used to assemble microelectronic components. The company, based in Haute-Savoie, has been serving the microelectronics industry for more than 40 years and making flip-chip bonders for 35.
What made you decide to join IRT Nanoelec?
Partnering with IRT Nanoelec is good for SET in a number of ways. First of all it will help us develop a new piece of equipment that will meet the microelectronics industry’s need for even greater speed and precision. IRT Nanoelec will help us test the equipment in actual manufacturing conditions with real components. Being a part of IRT Nanoelec will also give us an opportunity to network with experts from a variety of backgrounds, and that’s always a good thing.
And what will SET bring the other partners in the IRT Nanoelec 3D Integration program?
SET has a proven track record in precision equipment. And the new machine we are developing could also include other technologies like thermocompression and heating, which will open the door to other types of assemblies. We are also practically next door, which means we can be very responsive to our partners’ needs.