Look & Outlook at 3D Integration

(From « Scientific & Technical Highlights », ed. 2020) With the advent of Industry 4.0 and the era of connectivity, electronic devices use an ever increasing number of components. At a time when Moore’s Law is running out of steam, 3D integration represents an alternative for further developing multifunction chips while reducing overall dimensions. These 3D techniques … Lire la suite de Look & Outlook at 3D Integration