IRT Nanoelec attends 6th 3D TSV Summit

The 6th edition of Semi Europe’s 3D TSV Summit was held on January 22 to 24 in Dresden, Germany. It was attended by more than 170 3D integration and assembly experts.

The participants included major technology stakeholders like Intel, Qualcomm, STMicroelectronics, and GlobalFoundries.

IRT Nanoelec partners CEA-Leti and STMicroelectronics, as well as Mentor Graphics and EVG (also event sponsors) provided updates on their latest R&D. Sabrina Fadloun, the IRT Nanoelec PhD candidate who won the “My Thesis in 180 Seconds” competition also gave her pitch to an expert audience.

CEA-Leti, one of fourteen organizations to have exhibit booths at the event, highlighted the work being done at IRT Nanoelec.