The 3D integration program was present at the ECTC conference in Las Vegas on May 28–31. The event provided an opportunity to present the program’s latest results, with a particular focus on the direct hybrid chip-to-wafer bonding achieved with our partner SET.
- IRT Nanoelec
- Public Highlights 2021
- R&D Platforms
Home > Press > IRT Nanoelec at the Electronic Components and Technology Conference (ECTC)