{"id":2747,"date":"2024-10-12T11:14:43","date_gmt":"2024-10-12T09:14:43","guid":{"rendered":"https:\/\/irtnanoelec.fr\/?post_type=actualite&#038;p=2747"},"modified":"2026-01-15T12:43:13","modified_gmt":"2026-01-15T11:43:13","slug":"3d-packaging-achieving-3-layer-stacking-integration-for-future-smart-imagers-2","status":"publish","type":"actualite","link":"https:\/\/irtnanoelec.fr\/en\/actualite\/3d-packaging-achieving-3-layer-stacking-integration-for-future-smart-imagers-2\/","title":{"rendered":"3D packaging: Achieving 3-layer stacking integration for future smart imagers"},"content":{"rendered":"    <section class=\" section-normal push-edito \" id=\"block-block_34c3dff094af403850a51c17920c5f7f\">\n        <div class=\"container\">\n            <div class=\"flex gap-6 items-center flex-md-column-reverse flex-row-reverse\">\n                                <div class=\"bg-neutral-0 z-9 flex justify-center flex-column col-sm-12 flex-1\">\n                    <div class=\"description\"><h4>This article focuses on the silicon technology developments done by CEALeti regarding wafer-to-wafer hybrid bonding and HD TSVs and it presents the recent demonstrations of 2-layer and 3-layer stacking integrations. These demonstrations, together with the work done by other partners of the IRT Smart Imager Program (STMicroelectronics, Siemens EDA, Prophesee, Lynred, Grenoble INP-UGA) on applications and architecture studies, design tools and methodologies, and neural networks optimizations, are key and pave the way for the next generation of smart imagers.\u200b\u200b<\/h4>\n<p>&nbsp;<\/p>\n<p>Chip Scale Review July-August 2024 (Volume 28, Number 4), \u201cAchieving 3-layer stacking integration for future smart imagers\u201d, Stephan Borel, St\u00e9phane Nicolas<\/p>\n<p>A lire en anglais<\/p>\n<\/div>                <\/div>\n                \n                   \n            <\/div>\n        <\/div>\n    <\/section>\n\n<p><\/p>\n","protected":false},"featured_media":0,"template":"","meta":{"_acf_changed":true,"inline_featured_image":false},"categories":[],"class_list":["post-2747","actualite","type-actualite","status-publish","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.1.1 - 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